Attention to Material Patents regarding Fluorinated Silicone Thin Films, Encapsulments and Adhesives

Attention to Material Patents regarding Fluorinated Silicone Thin Films, Encapsulments and Adhesives, Etc.


In semiconductor processes, fluorinated silicone is growing as a core material having uses in adhesives, encapsulments and thin films, etc. due to its high tensile strength at high temperatures, excellent electric insulation and its chemical resistance.


According to the Korean Intellectual Property Office (KIPO), there have been 189 such patent applications during the last 10 years (2009~2018).


<Patent Application Trend during the Most 10 Years (‘09~’18)>

Reviewing cases by specific technology applied as the target of fluorinated silicone during the most recent 5 years (2014~2018), it can be seen that use for thin films involved 48 cases (44%), use for adhesives was 12 cases (11%), use for encapsulment made up 8 cases (7%) and use for other surface treatment materials and etching liquids, etc. involved 40 cases (37%).


<Patent Application Trend per Fluorinated Silicone Applied Target during the Most Recent 5 Years (‘14~’18)>


Uses for adhesive and encapsulment were intensively filed, comprising 60% of all fluorinated silicone applications in 2014~2015, but in 2016~2017, use for thin films owned the majority of applications at 58%. This is because the scope of practical uses for thin films is broader than the uses as adhesives or encapsulments, and accordingly, thin films are variously used for design and structure of semiconductor substrates and new elements in AI semiconductors and Internet of Things (IoT), etc. that are core parts of the Fourth Industrial Revolution.


Looking at the trend for applicants, during the most recent 5 years (2014~2018), applications by JP corporations such as DAIKIN INDUSTRIES, LTD. comprised 46% of all applications, while applications by domestic corporations such as DONGWOO FINE-CHEM CO., LTD. made up 34%, so JP corporations owned a larger proportion than domestic corporations.


During the most recent 5 years (2014~2018), JP corporations filed 9 cases (12%) and 3 cases (6%) for uses for adhesive or encapsulment, respectively, so these are similar to the 4 cases (11%) and 5 cases (14%) respectively filed by domestic corporations. However, in the case of use for thin films, as applications by JP corporations involved 32 cases (64%), it can be seen that this is more than two times greater than the 12 cases (32%) of such applications filed by domestic corporations.


The Fibrous Polymeric Examination Team Chief of KIPO stated, “Because the localization rate for semiconductor materials is not high, in light of recent JP export regulations, technology development and essential patent possession by capable domestic corporations regarding fluorinated silicone, which is a special material having both high value and high functionality, is important.”


[Source: KIPO]

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